#manufacturing

• 8/24/26 Kyoto University builds transistor that survives 600C temperatures, compatible with standard fabs — Standard ion implantation and bottom-gate design fix leakage and voltage drift
• 6/24/26 TSMC is reportedly hiking prices for 'all advanced nodes,' accounting for 74% of the company’s wafer business — Nvidia, AMD, Apple, Qualcomm, and others will face higher wafer costs
• 4/27/26 TSMC's details next-gen CoWoS roadmap: over 14-reticle packages and 48x leap in compute power expected by 2029 — massive size enables 24 HBM5E stacks and additional memory bandwidth jump